DocumentCode
614518
Title
Non-destructive volume and thickness measurements with planar microwave sensors
Author
Al Jader, M. ; Korostynska, O. ; Mason, Alex ; Al-Shamma´a, A.I.
Author_Institution
Built Environ. & Sustainable Technol. (BEST) Res. Inst., Liverpool John Moores Univ., Liverpool, UK
fYear
2013
fDate
16-19 April 2013
Firstpage
465
Lastpage
468
Abstract
This paper reports on the development of novel microwave sensors for non-destructive volume and thickness measurements in real-time. The sensors are in the form of metal patterns printed on planar substrates, and the type of both the metal and the substrate used alters the sensitivity of the sensor. In particular, changes in the response of these sensors in the microwave region of the electromagnetic spectrum when in contact with deionised water of 10-350 μl volumes and polyvinyl cellulose in 0.15-0.60 mm thicknesses are used as an indicator of volume/thickness respectively. Resonant peaks change their frequency and amplitude depending on the type and amount of material brought in contact with the sensor. This method offers increased sensitivity, real-time response and non-destructive evaluation of material type and profile, which can be used for structural health monitoring, for concealed target detection and security, and in a range of biomedical applications.
Keywords
microwave detectors; microwave propagation; nondestructive testing; polymers; thickness measurement; volume measurement; water; biomedical application; concealed target detection; deionised water; electromagnetic spectrum; metal pattern; nondestructive thickness measurement; nondestructive volume measurement; planar microwave sensor; planar substrate; polyvinyl cellulose; size 0.15 mm to 0.60 mm; structural health monitoring; Microwave measurement; Microwave sensors; Resonant frequency; Sensors; Substrates; microwave sensor; real-time measurements; resonant frequency shift; signature spectra; silver and gold printed patterns;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics and Nanotechnology (ELNANO), 2013 IEEE XXXIII International Scientific Conference
Conference_Location
Kiev
Print_ISBN
978-1-4673-4669-6
Type
conf
DOI
10.1109/ELNANO.2013.6552096
Filename
6552096
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