DocumentCode :
614905
Title :
Table of contents
fYear :
2013
fDate :
14-16 May 2013
Firstpage :
1
Lastpage :
9
Abstract :
The following topics are dealt with: advanced patterning/design for manufacturing; factory optimization; 3D/TSV technology; yield enhancement; advanced metrology; defect inspection; advanced equipment processes and materials; e-beam inspection; and APC.
Keywords :
inspection; integrated circuit yield; semiconductor device manufacture; three-dimensional integrated circuits; 3D technology; APC; TSV technology; advanced design; advanced equipment materials; advanced equipment processes; advanced metrology; advanced patterning; advanced semiconductor manufacturing; defect inspection; e-beam inspection; factory optimization; yield enhancement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Manufacturing Conference (ASMC), 2013 24th Annual SEMI
Conference_Location :
Saratoga Springs, NY
ISSN :
1078-8743
Print_ISBN :
978-1-4673-5006-8
Type :
conf
DOI :
10.1109/ASMC.2013.6552742
Filename :
6552742
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=614905
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