DocumentCode
614919
Title
Defect reduction by nitrogen purge of wafer carriers
Author
Van Roijen, R. ; Joshi, Pankaj ; Bailey, D. ; Conti, Stefania ; Brennan, W. ; Findeis, P.
Author_Institution
Microelectron. Div., IBM, Hopewell Junction, NY, USA
fYear
2013
fDate
14-16 May 2013
Firstpage
338
Lastpage
341
Abstract
Nitrogen purge of wafer carriers is driving defect density reduction at critical process steps. We discuss the mechanism of defect creation and how nitrogen purge improves defect density. We report on experimental split data from in line inspection and the impact at electrical test. The effect on volume manufacturing is demonstrated.
Keywords
inspection; semiconductor device manufacture; critical process; defect density reduction; electrical test; inspection; nitrogen purge; volume manufacturing; wafer carriers; Contamination; Epitaxial growth; Logic gates; Manufacturing; Nitrogen; Silicon germanium; Surface cleaning; Contamination; Semiconductor processing;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference (ASMC), 2013 24th Annual SEMI
Conference_Location
Saratoga Springs, NY
ISSN
1078-8743
Print_ISBN
978-1-4673-5006-8
Type
conf
DOI
10.1109/ASMC.2013.6552756
Filename
6552756
Link To Document