• DocumentCode
    614951
  • Title

    New vaporization sources for H2O2 for pre-treatment/cleaning of ALD deposition surfaces

  • Author

    Alvarez, Daniel ; Heinlein, Ed ; Holmes, Russell J. ; Arya, Bhuvnesh ; Shon-Roy, Lita ; Spiegelman, Jeff

  • Author_Institution
    RASIRC, San Diego, CA, USA
  • fYear
    2013
  • fDate
    14-16 May 2013
  • Firstpage
    159
  • Lastpage
    162
  • Abstract
    High mobility channel materials and new device structures will be needed to meet the power and performance specifications in future technology nodes. In these new material systems and devices various electrically active defects are present at or close to the interface between the high-k dielectric and the alternative channel material causing a major concern for both the performance and the reliability of these new devices. Novel “dry” cleaning and surface preparation methods are now being sought, where the term “dry” refers to gas phase or vapor chemistries. Our approach entails the development of hydrogen peroxide (H2O2) vapor phase chemistries, where H2O2/water mixtures are delivered and removed in gas phase.
  • Keywords
    atomic layer deposition; high-k dielectric thin films; hydrogen compounds; semiconductor device reliability; surface cleaning; ALD deposition surfaces; H2O2; device performance; device reliability; dry cleaning method; electrically active defects; gas phase chemistry; germanium; high mobility channel materials; high-k dielectric; hydrogen peroxide; material systems; performance specifications; power specifications; pretreatment; surface preparation method; vapor chemistry; vaporization sources; Chemicals; Hydrogen; Liquids; Surface cleaning; ALD; Germanium; Hydrogen Peroxide Delivery; Surface Cleaning; Surface Preparation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference (ASMC), 2013 24th Annual SEMI
  • Conference_Location
    Saratoga Springs, NY
  • ISSN
    1078-8743
  • Print_ISBN
    978-1-4673-5006-8
  • Type

    conf

  • DOI
    10.1109/ASMC.2013.6552788
  • Filename
    6552788