Statistical correlation of inline defect to sort test in semiconductor manufacturing

A yield analysis method using basic yield and inline defect information to statistically determine significant root-causes of yield loss in semiconductor manufacturing is presented. Using simple statistics on pass/fail die and defect maps, the goal of this method is to provide the fab process line with feedback on the yield loss impact for defect inspected process layers. Quantifying these losses, in terms of yield loss percent and statistical confidence allows the fab to set priorities for defect reduction work and achieve maximum yield enhancement. Using statistics, valid yield loss sources can be separated from nonkiller or nuisance defects. This tool can also be used to select the most effective inspection tool or recipe for a given inspection layer. Results are readily integrated with additional yield analysis results for a comprehensive yield loss accounting system.