DocumentCode
614970
Title
Case studies of fault isolation for the global failing patterns on SRAM bitmap caused by the defects in peripheral logic regions
Author
Jianhua Yin ; Jian Yu ; Sheng Xie ; Dapeng Sun ; Yong Ern Ling ; Zhigang Song ; Schiller, Carl E. ; Teverskoy, Genadi ; Villalobos, Manuel J.
Author_Institution
GLOBALFOUNDRIES, Hopewell Junction, NY, USA
fYear
2013
fDate
14-16 May 2013
Firstpage
226
Lastpage
230
Abstract
Product-like functional SRAM test chips have been widely used to capture systematic yield loss mechanisms during yield learning. Especially in early technology development, the top failing modes contributing to bit loss count are global patterns in the SRAM bitmap, which are highly suspected to be caused by defects in the peripheral control circuits. This paper describes a fault isolation flow on for global patterns which combines bitmap analysis, SRAM functional test debugging, circuit layout tracing analysis and physical failure analysis.
Keywords
SRAM chips; failure analysis; fault simulation; integrated circuit yield; logic testing; SRAM bitmap; SRAM functional test debugging; SRAM test chips; bit loss count; bitmap analysis; circuit layout tracing analysis; defects; failing modes; fault isolation flow; global patterns; peripheral control circuits; physical failure analysis; systematic yield loss mechanisms; yield learning; Circuit faults; Failure analysis; Latches; Layout; Random access memory; Redundancy; SRAM bitmap; fault isolation; global failing patterns; yield learning;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference (ASMC), 2013 24th Annual SEMI
Conference_Location
Saratoga Springs, NY
ISSN
1078-8743
Print_ISBN
978-1-4673-5006-8
Type
conf
DOI
10.1109/ASMC.2013.6552809
Filename
6552809
Link To Document