• DocumentCode
    614970
  • Title

    Case studies of fault isolation for the global failing patterns on SRAM bitmap caused by the defects in peripheral logic regions

  • Author

    Jianhua Yin ; Jian Yu ; Sheng Xie ; Dapeng Sun ; Yong Ern Ling ; Zhigang Song ; Schiller, Carl E. ; Teverskoy, Genadi ; Villalobos, Manuel J.

  • Author_Institution
    GLOBALFOUNDRIES, Hopewell Junction, NY, USA
  • fYear
    2013
  • fDate
    14-16 May 2013
  • Firstpage
    226
  • Lastpage
    230
  • Abstract
    Product-like functional SRAM test chips have been widely used to capture systematic yield loss mechanisms during yield learning. Especially in early technology development, the top failing modes contributing to bit loss count are global patterns in the SRAM bitmap, which are highly suspected to be caused by defects in the peripheral control circuits. This paper describes a fault isolation flow on for global patterns which combines bitmap analysis, SRAM functional test debugging, circuit layout tracing analysis and physical failure analysis.
  • Keywords
    SRAM chips; failure analysis; fault simulation; integrated circuit yield; logic testing; SRAM bitmap; SRAM functional test debugging; SRAM test chips; bit loss count; bitmap analysis; circuit layout tracing analysis; defects; failing modes; fault isolation flow; global patterns; peripheral control circuits; physical failure analysis; systematic yield loss mechanisms; yield learning; Circuit faults; Failure analysis; Latches; Layout; Random access memory; Redundancy; SRAM bitmap; fault isolation; global failing patterns; yield learning;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference (ASMC), 2013 24th Annual SEMI
  • Conference_Location
    Saratoga Springs, NY
  • ISSN
    1078-8743
  • Print_ISBN
    978-1-4673-5006-8
  • Type

    conf

  • DOI
    10.1109/ASMC.2013.6552809
  • Filename
    6552809