Pre-clean synergy with poly EMP process

This paper describes the process integration between pre-clean and poly-silicon (poly) chemical mechanical polishing (CMP) processes that result in the most cost effective manufacturing capability. It is shown how the choice of pre-clean and dryer variables can influence the throughput of the poly CMP process. This indirectly takes away redundant process steps and reduces manufacturing cost. It was observed that different pre-clean process variables result in various surface potential charges and conditions that can influence the polish rate of the poly-silicon during the CMP process.