DocumentCode
615042
Title
Design optimization of energy-efficient hydrophobic wafer-bonded III-V/Si semiconductor optical amplifiers
Author
Cheung, Stephane ; Kuanping Shang ; Kawakita, Y. ; Yoo, S.J.B.
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of California, Davis, Davis, CA, USA
fYear
2013
fDate
5-8 May 2013
Firstpage
108
Lastpage
109
Abstract
We discuss optimum design strategies for high-efficiency hybrid semiconductor optical amplifiers. Optimizing the bonding layer, III-V wafer stack design, straight hybrid amplifier dimensions, and flared amplifier configurations leads to a design for up to 35% wall-plug efficiency at 2mW input and 10dB gain.
Keywords
III-V semiconductors; elemental semiconductors; hydrophobicity; indium compounds; semiconductor optical amplifiers; silicon; wafer bonding; In0.8095Ga0.1905As0.4147P0.5853-Si; bonding layer; design optimization; energy-efficient semiconductor optical amplifiers; flared amplifier; gain 10 dB; hybrid semiconductor optical amplifier; hydrophobic semiconductor optical amplifiers; power 2 mW; straight hybrid amplifier; wafer bonded semiconductor optical amplifiers; wafer stack design; Bonding; Indium phosphide; Optical transmitters; Semiconductor optical amplifiers; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Optical Interconnects Conference, 2013 IEEE
Conference_Location
Santa Fe, NM
Print_ISBN
978-1-4673-5061-7
Electronic_ISBN
978-1-4673-5062-4
Type
conf
DOI
10.1109/OIC.2013.6552947
Filename
6552947
Link To Document