Title :
A fully-integrated flexible photonic platform for chip-to-chip optical interconnects
Author :
Juejun Hu ; Lan Li ; Hongtao Lin ; Yi Zou ; Tian Gu ; Haney, Mike
Author_Institution :
Dept. of Mater. Sci. & Eng., Univ. of Delaware, Newark, DE, USA
Abstract :
We analyze a chip-to-chip optical interconnect platform based on our recently developed flexible substrate integration technology. We show that the architecture achieves high integration density, low energy-per-bit, and does not require optical alignment during packaging.
Keywords :
integrated optics; optical interconnections; packaging; chip-to-chip optical interconnects; flexible substrate integration technology; integration density; optical alignment; packaging; Integrated circuit interconnections; Optical device fabrication; Optical fiber cables; Optical interconnections; Optical resonators; Optical surface waves; Optical waveguides;
Conference_Titel :
Optical Interconnects Conference, 2013 IEEE
Conference_Location :
Santa Fe, NM
Print_ISBN :
978-1-4673-5061-7
Electronic_ISBN :
978-1-4673-5062-4
DOI :
10.1109/OIC.2013.6552959
