DocumentCode
615539
Title
To: Attendees of the 31st Electrical Insulation Conference [welcome message]
Author
Stone, G.
fYear
2013
fDate
2-5 June 2013
Firstpage
1
Lastpage
1
Abstract
It gives me great pleasure to welcome you to the 31st Electrical Insulation Conference. The EIC has been continuously held every two years since 1958. It is the premier applications oriented conference in North America and is the only conference of its kind sponsored by the Dielectrics and Electrical Insulation Society of the IEEE. As such, the papers presented are oriented to the new and improved insulation systems and related diagnostics for electrical equipment A major change in the EIC was implemented this year by the IEEE Dielectrics and Electrical Insulation Society. The IEEE EIC will now be an annual event since it was decided to merge the EIC with the IEEE International Symposium on Electrical Insulation. This merger was implemented since many attendees were sometimes confused by the slightly different objectives of the two conferences.
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation Conference (EIC), 2013 IEEE
Conference_Location
Ottawa, ON, Canada
Print_ISBN
978-1-4673-4738-9
Electronic_ISBN
978-1-4673-4739-6
Type
conf
DOI
10.1109/EIC.2013.6554187
Filename
6554187
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