• DocumentCode
    615539
  • Title

    To: Attendees of the 31st Electrical Insulation Conference [welcome message]

  • Author

    Stone, G.

  • fYear
    2013
  • fDate
    2-5 June 2013
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    It gives me great pleasure to welcome you to the 31st Electrical Insulation Conference. The EIC has been continuously held every two years since 1958. It is the premier applications oriented conference in North America and is the only conference of its kind sponsored by the Dielectrics and Electrical Insulation Society of the IEEE. As such, the papers presented are oriented to the new and improved insulation systems and related diagnostics for electrical equipment A major change in the EIC was implemented this year by the IEEE Dielectrics and Electrical Insulation Society. The IEEE EIC will now be an annual event since it was decided to merge the EIC with the IEEE International Symposium on Electrical Insulation. This merger was implemented since many attendees were sometimes confused by the slightly different objectives of the two conferences.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference (EIC), 2013 IEEE
  • Conference_Location
    Ottawa, ON, Canada
  • Print_ISBN
    978-1-4673-4738-9
  • Electronic_ISBN
    978-1-4673-4739-6
  • Type

    conf

  • DOI
    10.1109/EIC.2013.6554187
  • Filename
    6554187