DocumentCode :
615623
Title :
Comparison between the use of surface and volume conductivity to compute potential distribution along an insulator in presence of a thin conductive layer
Author :
Volat, Christophe
Author_Institution :
Univ. of Quebec at Chicoutimi, Chicoutimi, QC, Canada
fYear :
2013
fDate :
2-5 June 2013
Firstpage :
409
Lastpage :
413
Abstract :
This paper describes a comparative study on the modeling of a thin conductive dielectric layer usually found on polluted or ice-covered insulators. Two different approaches such as those offered by most FEM commercial software were studied. The first one is a volume approach which takes into account the thickness of the thin layer. The second is the surface approach where the thin layer is treated as a specific boundary condition. Simulations were performed using the FEM commercial software Comsol Multiphysics® that allows both volume and surface approaches. Parameters such as conductivity and permittivity of the thin layer as well as the number of elements used are studied both in 2D axisymmetric and 3D modeling. The results obtained demonstrated that the surface approach is the best solution as it provides the same results as the volume approach but with 3 times less elements required for the mesh. The surface approach should then be considered for 3D complex problems where thin conductive dielectric layer is present.
Keywords :
finite element analysis; insulator contamination; permittivity; surface conductivity; 2D axisymmetric modeling; 3D complex problem; 3D modeling; FEM commercial software Comsol Multiphysics; conductive dielectric layer; ice-covered insulators; insulator; polluted insulators; potential distribution; specific boundary condition; surface approach; surface conductivity; thin-conductive dielectric layer; thin-layer permittivity; thin-layer thickness; volume approach; volume conductivity; Conductivity; Electric potential; Finite element analysis; Insulators; Permittivity; Solid modeling; Surface contamination; FEM; polluted insulator; potential distribution; thin conductive dielectric layer;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation Conference (EIC), 2013 IEEE
Conference_Location :
Ottawa, ON
Print_ISBN :
978-1-4673-4738-9
Electronic_ISBN :
978-1-4673-4739-6
Type :
conf
DOI :
10.1109/EIC.2013.6554278
Filename :
6554278
Link To Document :
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