DocumentCode :
615644
Title :
Current rating methodology for mass impregnated HVDC cables
Author :
Huang, Z.Y. ; Pilgrim, J.A. ; Lewin, P.L. ; Swingler, S.G. ; Payne, David
Author_Institution :
Tony Davies High Voltage Lab., Univ. of Southampton, Southampton, UK
fYear :
2013
fDate :
2-5 June 2013
Firstpage :
513
Lastpage :
517
Abstract :
Calculating the current rating of HVDC cable systems is less straightforward than for ac cables, which are always thermally limited. While the permissible current in an HVDC cable circuit may be limited by the operating temperature of the dielectric, it may also be restricted by the electric stress within the dielectric. Conventional current rating calculations such as IEC 60287 are thus ill suited to HVDC applications. This paper demonstrates the importance of the electric stress constraint through the application of finite element modeling techniques which permit a coupling of the thermal and electrical properties within the cable. The results obtained demonstrate that changes within the installation environment cause the limiting factor to switch from thermal to electrical under steady state conditions, demonstrating the importance of developing calculation methods which can represent both cases.
Keywords :
HVDC power transmission; IEC standards; finite element analysis; impregnated insulation; power cable insulation; AC cables; HVDC cable systems; IEC 60287; VDC cable circuit; conventional current rating calculations; current rating methodology; electric stress constraint; electrical property; finite element modeling techniques; installation environment; limiting factor; mass impregnated HVDC cables; operating temperature; thermal property; Dielectric losses; HVDC transmission; Power cable insulation; Power cables; Stress; HVDC transmission; cables; finite element methods;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation Conference (EIC), 2013 IEEE
Conference_Location :
Ottawa, ON
Print_ISBN :
978-1-4673-4738-9
Electronic_ISBN :
978-1-4673-4739-6
Type :
conf
DOI :
10.1109/EIC.2013.6554301
Filename :
6554301
Link To Document :
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