Title :
Performance analysis of a multi-PHY coexistence mechanism for IEEE 802.15.4g FSK network
Author :
Chin-Sean Sum ; Kojima, Fumihide ; Harada, Hiroshi
Author_Institution :
Nat. Inst. of Inf. & Commun. Technol. (NICT), Yokosuka, Japan
Abstract :
This paper analyzes the performance of a realistic multi-PHY layer IEEE 802.15.4g Smart Utility Networks (SUN) design and proposes a coexistence approach for multi-PHY interference management. Technical details of the design such as network architecture, mechanism protocols, signal formats, device interfaces, regulatory requirements and channel characterization are implemented following the IEEE 802.15.4g SUN specification. The performance evaluation is conducted in a cross-layer computer simulation based on the MAC (medium access control) and multi-PHY technical specification in the standard with realistic application scenarios and channel characteristics. To manage the interference in the system, a Multi-PHY Management (MPM) protocol is proposed and evaluated. The MPM is adopted in the current IEEE 802.15.4g standard. As a result, the coexistence mechanism is observed to be able to improve the victim throughput performance up to 25%. It is also found that the throughput degradation in a non-beacon-enabled network is 50% worse than the degradation in a beacon-network.
Keywords :
Zigbee; access protocols; computer network management; radiofrequency interference; IEEE 802.15.4g FSK network; IEEE 802.15.4g standard; MAC; MPM protocol; channel characterization; cross-layer computer simulation; device interfaces; mechanism protocols; medium access control; multiPHY coexistence mechanism; multiPHY interference management; multiPHY management protocol; network architecture design; nonbeacon-enabled network; smart utility network design; Frequency shift keying; IEEE 802.15 Standards; Interference; Mathematical model; OFDM; Protocols; Throughput; IEEE 802.15.4g; Multi-PHY layer; coexistence; smart utility networks;
Conference_Titel :
Wireless Communications and Networking Conference (WCNC), 2013 IEEE
Conference_Location :
Shanghai
Print_ISBN :
978-1-4673-5938-2
Electronic_ISBN :
1525-3511
DOI :
10.1109/WCNC.2013.6554536