Title :
Resonant frequency analysis for spring-mass structure in high-g MEMS accelerometer
Author :
Zhenya Geng ; Vi Shen ; Miao Zhang ; Muhua Li ; Jing Jin
Author_Institution :
Dept. of Eng. & Controlling, Harbin Inst. of Technol., Harbin, China
Abstract :
Spring-mass structure of high-g MEMS accelerometer is designed based on lumped-parameter analytical models and polymer film-beam constraints structure. The film-beam bone of spring-mass structure is used from silicon and organic polymer film material. The mechanical structure characteristic performs a sort of vibration flexibility to resonant frequency from its single proof-mass movement. According to the result of simulation and analysis, the parameters size of spring-mass structure is obtained to optimize on operational frequency and high-g range. At the same time, its sensitivity capability is improved to high-g MEMS accelerometer. Besides, stress curve and strain situation of the spring-mass structure are obtained by acceleration force opposing motion simulation. These simulation data describes elasticity architecture rationality of mechanical components, which provides favorable help to accomplish coating organic polymer film fabrication. The design and coating polymer fabrication can enhance robustness and stability to high-g MEMS accelerometer.
Keywords :
accelerometers; microfabrication; microsensors; polymer films; silicon; acceleration force; coating organic polymer film fabrication; film-beam bone; high-g MEMS accelerometer; lumped-parameter analytical models; mechanical components; mechanical structure characteristic; motion simulation; organic polymer film material; polymer film-beam constraints structure; proof-mass movement; resonant frequency analysis; silicon polymer film material; spring-mass structure; vibration flexibility; Accelerometers; Analytical models; Elasticity; Micromechanical devices; Resonant frequency; Stress; Vibrations; Spring-mass structure; high-g MEMS accelerometer; resonant frequency; sensitivity capability;
Conference_Titel :
Instrumentation and Measurement Technology Conference (I2MTC), 2013 IEEE International
Conference_Location :
Minneapolis, MN
Print_ISBN :
978-1-4673-4621-4
DOI :
10.1109/I2MTC.2013.6555456