• DocumentCode
    616850
  • Title

    Optimization for temperature estimation using magnetic nanoparticle: A set of equations solving solution investigation

  • Author

    Jing Zhong ; Wenzhong Liu ; Shiqiang Pi ; Pu Zhang

  • Author_Institution
    Dept. of Control Sci. & Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China
  • fYear
    2013
  • fDate
    6-9 May 2013
  • Firstpage
    1329
  • Lastpage
    1331
  • Abstract
    This paper investigates a set of equations solving solution for magnetic nanoparticle temperature estimation. To achieve the temperature estimation using magnetic nanoparticles, a solution should be employed to solve the set of equations. And the solution to solve the set of equations is a key factor that affects the accuracy of temperature probing. To determine the dependence of the solution on the temperature probing accuracy, the matrix solution and least square solution were presented to solve the set of equations by simulation. The simulation results shows that, the matrix solution allows a maximum temperature probing error of 2 K with a standard deviation of 0.79 K, whereas the least square solution allows a maximum temperature error of 0.08 K with a standard deviation of 0.034 K. It indicates that the temperature probing accuracy was improved by a factor of 20 using the optimized solution of least square solution to solve the set of equations.
  • Keywords
    least squares approximations; matrix algebra; nanoparticles; temperature measurement; least square solution; magnetic nanoparticle temperature estimation; matrix solution; maximum temperature probing error; optimization; standard deviation; temperature 0.08 K; temperature estimation; Accuracy; Equations; Estimation; Magnetic susceptibility; Mathematical model; Nanoparticles; Temperature; magnetic nanoparticles; temperature estimation; the least square solution; the matrix solution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Instrumentation and Measurement Technology Conference (I2MTC), 2013 IEEE International
  • Conference_Location
    Minneapolis, MN
  • ISSN
    1091-5281
  • Print_ISBN
    978-1-4673-4621-4
  • Type

    conf

  • DOI
    10.1109/I2MTC.2013.6555629
  • Filename
    6555629