Title :
The UHF Gen 2 RFID System for transcutaenous operation for orthopedic implants
Author :
Xiaoyu Liu ; Stachel, Joshua R. ; Stachel, Ervin ; Mickle, M.H. ; Berger, J.L.
Author_Institution :
Electr. & Comput. Eng, Univ. of Pittsburgh Pittsburgh, Pittsburgh, PA, USA
Abstract :
This paper aims to develop a UHF Gen 2 RFID system for transcutaneous operation for identifying and monitoring orthopedic implants. The major problems of using existing RFID antennas at UHF band for transcutaneous operation include possible interference with pacemakers and interference with other RFID systems working at the same band. To provide a solution for the above problems, this paper uses transcutaneous near field communication (TNFC) technology based on capacitive coupling between the reader and the tag. The reader and tag both have two electrodes and the energy and signal transmission occurs with the coupling between the electrodes. Both the reader and the tag are impedance matched for maximum power transmission efficiency. A reading range of 4.1 cm is achieved through pork skin using 30 dBm power from the reader. The proposed UHF RFID system is a feasible solution to provide high efficiency for transcutaneous operation while can eliminate an interference with other medical devices or RFID devices.
Keywords :
UHF antennas; biomedical electrodes; impedance matching; near-field communication; orthopaedics; pacemakers; patient monitoring; power transmission; radiofrequency identification; skin; RFID antennas; RFID devices; TNFC technology; UHF Gen 2 RFID system; UHF band; capacitive coupling; electrodes; energy transmission; medical devices; orthopedic implants; pacemakers; pork skin; power transmission efficiency; signal transmission; transcutaenous operation; transcutaneous near field communication; Electrodes; Implants; Interference; Pacemakers; Probes; Radiofrequency identification; RFID; UHF; electrodes; orthopedic implant; transcutaneous near field communication;
Conference_Titel :
Instrumentation and Measurement Technology Conference (I2MTC), 2013 IEEE International
Conference_Location :
Minneapolis, MN
Print_ISBN :
978-1-4673-4621-4
DOI :
10.1109/I2MTC.2013.6555688