DocumentCode :
617066
Title :
A review of cryogenic power electronics - status and applications
Author :
Rajashekara, Kaushik ; Akin, Bilal
Author_Institution :
Electr. Eng. Dept., Univ. of Texas at Dallas, Richardson, TX, USA
fYear :
2013
fDate :
12-15 May 2013
Firstpage :
899
Lastpage :
904
Abstract :
Increased need for power density and close integration of power subsystems associated with superconductive motors/generators, degaussing coils, energy storage modules and cables leads one to consider the merits of refrigerating the power electronics down to cryogenic temperatures. High-temperature superconducting components combined with cryogenic power converters will have a significant effect on electrification of transportation and high power density power conversion systems. Cryogenic power converter modules provide other promising benefits over their room temperature counterparts in terms of reduced size and weight (increased power density); improved efficiency, switching speed, and reliability. Such integration could result in significant weight and space savings for the overall system. In this paper, a review of the status of research in cryogenic power electronics and their potential applications is presented.
Keywords :
cables (electric); cryogenic electronics; energy storage; high-temperature superconductors; power conversion; power electronics; reliability; superconducting coils; transportation; cable; close integration; cryogenic power electronics-status; cryogenic temperature; degaussing coil; energy storage module; high power density power conversion systems; high-temperature superconducting components; power density; power subsystem; refrigeration merits; reliability; space savings; superconductive motor-generator; temperature 293 K to 298 K; transportation electrification; Cryogenics; Generators; High-temperature superconductors; MOSFET; Power electronics; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electric Machines & Drives Conference (IEMDC), 2013 IEEE International
Conference_Location :
Chicago, IL
Print_ISBN :
978-1-4673-4975-8
Electronic_ISBN :
978-1-4673-4973-4
Type :
conf
DOI :
10.1109/IEMDC.2013.6556204
Filename :
6556204
Link To Document :
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