Title :
Improved Cultural Immune Systems to solve the economic load dispatch problems
Author :
Goncalves, Ricardo ; Almeida, Claudia ; Goldbarg, Marco ; Goldbarg, Elizabeth ; Delgado, M.
Author_Institution :
Dept. of Comput. Sci., UNICENTRO, Guarapuava, Brazil
Abstract :
This work considers Artificial Immune Systems to solve the economic load dispatch problem. The Immune Systems are based on the clonal selection principle. Cultural Algorithms using normative, situational, historical and topographical knowledge sources are used to improve the global optimization property of immune systems. A new main influence function is proposed which improves the results obtained by the cultural version. All the proposed approaches have several points of self-adaptation and use a local search operator that is based on a quasi-simplex technique. The Immune System and its cultural versions are validated in test problems that consider 13 and 40 thermal generators and take into account valve-point loading effects. They are also validated in a test problem with 20 thermal generators, valve-point loading effects and transmission losses. The proposed cultural method including the new influence function outperforms other modern metaheuristics reported in recent literature, finding the minimum fuel cost value for all test systems.
Keywords :
artificial immune systems; evolutionary computation; load dispatching; artificial immune systems; clonal selection principle; cultural algorithms; cultural immune systems; economic load dispatch problems; fuel cost value; historical knowledge source; immune system global optimization property; influence function; local search operator; normative knowledge source; quasi-simplex technique; self-adaptation; situational knowledge source; test systems; thermal generators; topographical knowledge source; transmission loss; valve-point loading effects; Cloning; Cultural differences; Equations; Immune system; Propagation losses; Sociology; Statistics;
Conference_Titel :
Evolutionary Computation (CEC), 2013 IEEE Congress on
Conference_Location :
Cancun
Print_ISBN :
978-1-4799-0453-2
Electronic_ISBN :
978-1-4799-0452-5
DOI :
10.1109/CEC.2013.6557626