DocumentCode
618295
Title
Accurate crosstalk analysis for RLCG on-chip VLSI global interconnect
Author
Maheshwari, V. ; Jha, Sumit Kumar ; Khare, Kavita ; Kar, Rajib ; Mandal, Durbadal
Author_Institution
Deptt. of ECE, Apeejay Stya Univ., Gurgaon, India
fYear
2013
fDate
11-12 April 2013
Firstpage
281
Lastpage
286
Abstract
This paper shows an accurate crosstalk noise analysis for RLCG on-chip VLSI global interconnects and also presents a fast response and accurate estimation of crosstalk noise generated due to coupling effect in multiple RLCG transmission lines. Due to the coupling effect, the performance of interconnect is degraded. This degradation is seen by the electronic design automation (EDA) tools. This RLCG transmission line is used for high frequency operations, so the estimation method for RLCG peak crosstalk noise is complex but give the fast and more accurate and better result comparable to the RC and RLC onchip VLSI global interconnects. In this paper the loading effect between aggressor and victim network has been considered and finally the expression for the peak crosstalk noise has been derived. This method gives a very fast and improved result than that of the SPICE result. The average error achieved for the peak noise is 1.88%.
Keywords
RLC circuits; VLSI; electronic design automation; integrated circuit interconnections; integrated circuit noise; transmission lines; EDA tools; RLCG on-chip VLSI global interconnects; accurate crosstalk noise analysis; accurate crosstalk noise estimation; aggressor; coupling effect; electronic design automation tools; fast response; high frequency operations; interconnect performance degradation; loading effect; multiple RLCG transmission lines; peak crosstalk noise; victim network; Capacitance; Couplings; Crosstalk; Equations; Integrated circuit modeling; Mathematical model; Noise; Crosstalk; Distributed RLC segments; On-Chip Interconnect; Output response; VLSI Noise Peak;
fLanguage
English
Publisher
ieee
Conference_Titel
Information & Communication Technologies (ICT), 2013 IEEE Conference on
Conference_Location
JeJu Island
Print_ISBN
978-1-4673-5759-3
Type
conf
DOI
10.1109/CICT.2013.6558106
Filename
6558106
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