Title :
Peak noise and noise width modelling for RLC global interconnects in deep submicron VLSI circuits
Author :
Maheshwari, V. ; Khare, Kavita ; Mukherjee, Sayan ; Kar, Rajib ; Mandal, Durbadal
Author_Institution :
Deptt. of ECE, Apeejay Stya Univ., Gurgaon, India
Abstract :
This paper presents a new method to estimate the crosstalk noise for on-chip VLSI RLC global interconnects using 2-π model. Distributed RLC on-chip global interconnects can be modelled for an above low frequency operation with sufficient accuracy and better result. To calculate this crosstalk noise we apply the unit step input to the aggressor network side which is adjacent to the victim network. This proposed model presents the noise voltage waveform by using 2-π model. This noise voltage generated at the output of the victim network. This paper also gives the idea of peak crosstalk noise amplitude and noise width for on-chip global RLC VLSI interconnects. Some mathematical technique are using for calculating the peak noise amplitude and noise width for RLC interconnect. The dominant pole method is best one because this method reduces the complexity of the transfer function of complex electrical network. So, the finally we get average error of less than 6% when compared to that of the SPICE simulation. So, this is the better technique to use than the SPICE result.
Keywords :
RLC circuits; VLSI; integrated circuit interconnections; integrated circuit noise; transfer functions; waveform analysis; 2-π model; aggressor network; complex electrical network; crosstalk noise estimation method; deep submicron VLSI circuits; distributed RLC on-chip global interconnects; dominant pole method; low frequency operation; mathematical technique; noise voltage waveform; noise width modelling; on-chip VLSI RLC global interconnects; peak crosstalk noise amplitude; peak noise amplitude calculation; transfer function complexity reduction; victim network; Couplings; Crosstalk; Integrated circuit interconnections; Integrated circuit modeling; Noise; SPICE; Very large scale integration; Crosstalk; Noise Modelling; On-Chip RLC Interconnect; Unit step Input;
Conference_Titel :
Information & Communication Technologies (ICT), 2013 IEEE Conference on
Conference_Location :
JeJu Island
Print_ISBN :
978-1-4673-5759-3
DOI :
10.1109/CICT.2013.6558113