Title :
3D modeling in PCI Express Gen1 and Gen2 high-speed SI simulation
Author :
Runjing Zhou ; Jinsong Hu
Author_Institution :
Dept. of Autom., Inner Mongolia Univ., Hohhot, China
Abstract :
PCI Express (PCIe) interface is widely used in current computer systems. In this paper, two 3D FEM modeling methodologies are introduced for the interested complex connector structure in the frequency domain. The PCIe Gen1 and Gen2 compliance measurement shows good agreement between simulation and measurement in the time domain. The study shows that 3D modeling is very important for PCIe Gen1 and Gen2 SI simulations.
Keywords :
finite element analysis; peripheral interfaces; solid modelling; 3D FEM modeling methodology; PCI express Gen1 high-speed SI simulation; PCI express Gen2 high-speed SI simulation; PCIe Gen1 compliance measurement; PCIe Gen2 compliance measurement; PCIe interface; complex connector structure; computer systems; frequency domain; time domain; Connectors; Field programmable gate arrays; Silicon; Solid modeling; Three-dimensional displays; Thumb; 3D FEM; PCIe Gen1; PCIe Gen2; SI simulation; compliance measurement;
Conference_Titel :
Signal and Power Integrity (SPI), 2013 17th IEEE Workshop on
Conference_Location :
Paris
Print_ISBN :
978-1-4673-5678-7
DOI :
10.1109/SaPIW.2013.6558321
