• DocumentCode
    618534
  • Title

    Application of the transverse resonance method for efficient extraction of the dispersion relation of arbitrary layers in silicon interposers

  • Author

    Dahl, David ; Xiaomin Duan ; Beyreuther, Anne ; Ndip, Ivan ; Lang, K.-D. ; Schuster, Christian

  • Author_Institution
    Inst. fur Theor. Elektrotechnik, Tech. Univ. Hamburg-Harburg (TUHH), Hamburg, Germany
  • fYear
    2013
  • fDate
    12-15 May 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In this article, the dispersion relation for horizontal wave propagation in silicon interposers consisting of arbitrary numbers of silicon and silicon dioxide layers between metal layers is investigated. Results are obtained by the transverse resonance method (TRM). The method is verified by comparison to results of finite element based full-wave simulations. The results of the TRM show good correspondence with those obtained by full-wave simulations and can be obtained within significantly shorter calculation times. Results for a typical layout of a silicon interposer and examples for thin silicon dioxide layers and a large number of layers are also presented. Further, an approximate solution for the fundamental mode of typical structures is given and examples show the applicability and limitations of the approximate solution.
  • Keywords
    elemental semiconductors; finite element analysis; silicon; three-dimensional integrated circuits; Si; TRM; arbitrary layers; dispersion relation; dispersion relation extraction; finite element-based full-wave simulations; fundamental mode; horizontal wave propagation; metal layers; silicon dioxide layer; silicon interposer layout; transverse resonance method; Attenuation; Conductivity; Finite element analysis; Metals; Propagation constant; Silicon; Transmission line measurements;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signal and Power Integrity (SPI), 2013 17th IEEE Workshop on
  • Conference_Location
    Paris
  • Print_ISBN
    978-1-4673-5678-7
  • Type

    conf

  • DOI
    10.1109/SaPIW.2013.6558345
  • Filename
    6558345