Fast estimation of high-speed signal integrity for coupled PCB interconnects

A predictive signal integrity (SI) model of coupled PCB interconnects for high-speed application is stated. It is derived from the analytical modeling of coupling matrices between neighboring transmission lines (TLs). The overall ABCD matrix is regenerated and manipulated by using the modal approach. Afterwards, the S-parameters of the structure are substantially extracted for forecasting the behavior SI propagating along the underlying interconnections. In order to reveal the effectiveness of the fast model developed, EM/circuit co-simulations with commercial tool were performed both in the frequency- and time-domains with 1Gbps-rate-mixed signals. Different configurations were undertaken. The validity of the centimeter length coupling model hereby with respect to the geometrical parameters of the interconnect structures is also investigated. Finally, potential applications for high-speed systems are discussed, especially for non-symmetrical coupled lines and microelectronic interconnects.