Characterization of bonding interface prepared by room temperature bonding after flattening by thermal imprint process

Author

Kurashima, Yuichi ; Maeda, Atsushi ; Takagi, Hiroyuki

Author_Institution

Res. Center for Ubiquitous MEMS & Micro Eng. (UMEMSME), Nat. Inst. of Adv. Ind. Sci. & Technol. (AIST), Tsukuba, Japan

fYear

2013

fDate

16-18 April 2013

Firstpage

1

Lastpage

4

Abstract

We developed the room temperature bonding of Au film flattened by thermal imprint process. The Au film surfaces were flattened by thermal imprint process. As a result, the flattening process was effective in case of the low bonding load or rougher Au surface. And we also apply developed process to bonding of seal ring patterns fabricated by Au electroplating. The surface of Au film could be successfully flattened by the thermal imprint process. As a result, large bonding strength was obtained for seal ring patterns with a width of 100 μm.

Keywords

bonding processes; electroplating; gold; microfabrication; bonding interface characterization; bonding strength; flattening process; gold electroplating; gold film surface; ring pattern seal; room temperature bonding; size 100 mum; thermal imprint process; Bonding; Films; Gold; Rough surfaces; Silicon; Surface roughness; Surface treatment; room temperature bonding; thermal imprint;

fLanguage

English

Publisher

ieee

Conference_Titel

Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2013 Symposium on

Conference_Location

Barcelona

Print_ISBN

978-1-4673-4477-7

Type

conf

Filename

6559410