• DocumentCode
    618661
  • Title

    Design of a monolithic 3-axis thermal convective accelerometer

  • Author

    Huy Binh Nguyen ; Mailly, Frederick ; Latorre, Laurent ; Nouet, Pascal

  • Author_Institution
    LIRMM, Univ. Montpellier 2, Montpellier, France
  • fYear
    2013
  • fDate
    16-18 April 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper presents the design of a monolithic 3axis thermal accelerometer using a standard CMOS process. Based on free convection in a sealed cavity, the sensing principle is well known and many examples of single and dual-axis MEMS accelerometers can be found in the literature. More recently, Finite Element Modeling has demonstrated the feasibility of a fully integrated 3-axis sensor manufactured with a simple post-process to partially etch silicon bulk of a CMOS die. A prototype was designed and fabricated; this paper presents the sensing cell, its associated conditioning electronics and preliminary characterization.
  • Keywords
    CMOS integrated circuits; accelerometers; elemental semiconductors; etching; finite element analysis; integrated circuit design; microfabrication; microsensors; monolithic integrated circuits; natural convection; silicon; temperature sensors; Si; cavity sealing; dual-axis MEMS accelerometer; etching; finite element modeling; free convection; fully integrated 3-axis sensor manufacturing; monolithic 3-axis thermal convective accelerometer; standard CMOS process; Acceleration; Accelerometers; Cavity resonators; Heating; Temperature measurement; Temperature sensors; CMOS; Convective accelerometer; MEMS;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2013 Symposium on
  • Conference_Location
    Barcelona
  • Print_ISBN
    978-1-4673-4477-7
  • Type

    conf

  • Filename
    6559446