DocumentCode
618676
Title
Table of contents
fYear
2013
fDate
16-18 April 2013
Abstract
The following topics are dealt with: metamaterials; diagnostic device; microfluidics; reliability; RF MEMS tactile sensors; MEMS accelerometers; assembly and packaging.
Keywords
accelerometers; assembling; circuit reliability; electronics packaging; metamaterials; microfluidics; microsensors; tactile sensors; MEMS accelerometer; RF MEMS tactile sensor; assembly; diagnostic device; metamaterial; microfluidics; packaging; reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2013 Symposium on
Conference_Location
Barcelona
Print_ISBN
978-1-4673-4477-7
Type
conf
Filename
6559461
Link To Document