Title :
Table of contents
Abstract :
The following topics are dealt with: metamaterials; diagnostic device; microfluidics; reliability; RF MEMS tactile sensors; MEMS accelerometers; assembly and packaging.
Keywords :
accelerometers; assembling; circuit reliability; electronics packaging; metamaterials; microfluidics; microsensors; tactile sensors; MEMS accelerometer; RF MEMS tactile sensor; assembly; diagnostic device; metamaterial; microfluidics; packaging; reliability;
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2013 Symposium on
Conference_Location :
Barcelona
Print_ISBN :
978-1-4673-4477-7
