Title :
A high sensitivity micromachined accelerometer with an enhanced inertial mass SOI MEMS process
Author :
Xie Jianbing ; Song Meng ; Yuan Weizheng
Author_Institution :
Micro & Nano Electromech. Syst. Lab., Northwestern Polytech. Univ., Xi´an, China
Abstract :
This paper provides an enhanced inertial mass SOI MEMS process for the fabrication of a high sensitivity micromachined accelerometer. In the proposed process, the handle layer of the SOI wafer is used as an enhanced inertial mass, in this way, the inertial mass of the accelerometer can increase 5-15 times. Therefore, the sensitivity of the MEMS accelerometer can be significantly increased. In this paper, an in-plane single-axis accelerometer is designed firstly. And then, the accelerometer is fabricated in a low resistivity SOI wafer with 60μm thickness device layer and 400μm thickness handle layer through the developed enhanced inertial mass SOI MEMS process. The sensitivity of the fabricated MEMS accelerometer is 2.257V/g, the linearity of output is within 0.5%,and the power spectral density of the noises is as low as 6.79uV/ Hz.
Keywords :
accelerometers; micromachining; micromechanical devices; silicon-on-insulator; MEMS accelerometer fabrication; MEMS accelerometer sensitivity; SOI wafer; high sensitivity micromachined accelerometer; in-plane single-axis accelerometer; inertial mass SOI MEMS process; power spectral density; size 400 mum; size 60 mum; thickness device layer; Accelerometers; Electrodes; Linearity; Micromechanical devices; Noise; Sensitivity; Sensors; SOI; enhanced inertial mass; high sensitivity; micromachined accelerometer;
Conference_Titel :
Nano/Micro Engineered and Molecular Systems (NEMS), 2013 8th IEEE International Conference on
Conference_Location :
Suzhou
Electronic_ISBN :
978-1-4673-6351-8
DOI :
10.1109/NEMS.2013.6559745