DocumentCode
619005
Title
Micro-Raman spectroscopy analysis of residual stress in polysilicon MEMS resonators
Author
Chenxu Zhao ; Mengwei Li ; Ming Yin ; Zewen Liu
Author_Institution
Inst. of Microelectron., Tsinghua Univ., Beijing, China
fYear
2013
fDate
7-10 April 2013
Firstpage
570
Lastpage
573
Abstract
This paper presents the recent results of utilization of micro-Raman spectroscopy to measure and characterize residual stress in polysilicon doubly-clamped MEMS resonators with small lateral size. Due to imprecise prediction of the magnitude of intrinsic residual stress, detrimental effect of the residual stress severely shifts the resonant frequency of MEMS resonator from the analytical pre-designed value. The stress is not only determined by the fabrication process but also related to the structural dimensions of resonators. In this work, microRaman spectroscopy was used to measure the residual stress of resonators with widths down to 2μm. The results show that the optimized resonator with length shorter than 50μm and width between 3.2μm and 4.1μm exhibits minimum residual stress.
Keywords
Raman spectroscopy; elemental semiconductors; internal stresses; micromechanical resonators; silicon; stress measurement; Si; fabrication process; intrinsic residual stress magnitude prediction; microRaman spectroscopy analysis; polysilicon MEMS resonators; residual stress analysis; residual stress measurement; resonant frequency shift; resonator structural dimensions; size 2 mum; size 3.2 mum to 4.1 mum; small lateral size; Logic gates; Micromechanical devices; Residual stresses; Silicon; Spectroscopy; Stress measurement; MEMS resonator; micro-Raman spectroscopy; residual stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems (NEMS), 2013 8th IEEE International Conference on
Conference_Location
Suzhou
Electronic_ISBN
978-1-4673-6351-8
Type
conf
DOI
10.1109/NEMS.2013.6559795
Filename
6559795
Link To Document