• DocumentCode
    619005
  • Title

    Micro-Raman spectroscopy analysis of residual stress in polysilicon MEMS resonators

  • Author

    Chenxu Zhao ; Mengwei Li ; Ming Yin ; Zewen Liu

  • Author_Institution
    Inst. of Microelectron., Tsinghua Univ., Beijing, China
  • fYear
    2013
  • fDate
    7-10 April 2013
  • Firstpage
    570
  • Lastpage
    573
  • Abstract
    This paper presents the recent results of utilization of micro-Raman spectroscopy to measure and characterize residual stress in polysilicon doubly-clamped MEMS resonators with small lateral size. Due to imprecise prediction of the magnitude of intrinsic residual stress, detrimental effect of the residual stress severely shifts the resonant frequency of MEMS resonator from the analytical pre-designed value. The stress is not only determined by the fabrication process but also related to the structural dimensions of resonators. In this work, microRaman spectroscopy was used to measure the residual stress of resonators with widths down to 2μm. The results show that the optimized resonator with length shorter than 50μm and width between 3.2μm and 4.1μm exhibits minimum residual stress.
  • Keywords
    Raman spectroscopy; elemental semiconductors; internal stresses; micromechanical resonators; silicon; stress measurement; Si; fabrication process; intrinsic residual stress magnitude prediction; microRaman spectroscopy analysis; polysilicon MEMS resonators; residual stress analysis; residual stress measurement; resonant frequency shift; resonator structural dimensions; size 2 mum; size 3.2 mum to 4.1 mum; small lateral size; Logic gates; Micromechanical devices; Residual stresses; Silicon; Spectroscopy; Stress measurement; MEMS resonator; micro-Raman spectroscopy; residual stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems (NEMS), 2013 8th IEEE International Conference on
  • Conference_Location
    Suzhou
  • Electronic_ISBN
    978-1-4673-6351-8
  • Type

    conf

  • DOI
    10.1109/NEMS.2013.6559795
  • Filename
    6559795