DocumentCode
619007
Title
Simulation of backward facing step flow at the outlet of micro-channel and optimal design of amperometric detection chip
Author
Xiaowei Liu ; He Zhang ; Xiaowei Han ; Lin Zhao
Author_Institution
Key Lab. of Micro-Syst. & Micro-Struct. Manuf., Harbin, China
fYear
2013
fDate
7-10 April 2013
Firstpage
578
Lastpage
581
Abstract
In this paper, we discussed the vortex which cause by the step structure at the outlet of microchannel. When the the thickness of boundary layer and the height of the channel are fixed value, the vortex area length was decided by Reynolds number. COMSOL Multiphysics simulations based on the turbulence model were performed to provide a better understanding of the Reynolds number and the length of vortex area in the compound structure microfluidic amperometric detection chip. According to the simulation results, we discussed the value for the height of the microchannel and the thickness of auxiliary bonding layer, we determined the manufacture parameters and assembly process of the microfluidic chip. Furthermore through the simulation results discussion of the microfluidic properties, we described how to set experiment conditions for amperometric detection.
Keywords
amperometric sensors; boundary layer turbulence; finite element analysis; flow simulation; microassembling; microchannel flow; microfluidics; microsensors; vortices; COMSOL Multiphysics simulations; Reynolds number; amperometric detection chip optimal design; auxiliary bonding layer thickness; backward facing step flow simulation; channel height; compound structure microfluidic amperometric detection chip; manufacturing parameters; microchannel outlet; microfluidic chip assembly process; microfluidic properties; step structure; turbulence model; vortex area length; Electrodes; Mathematical model; Microfluidics; Numerical models; Simulation; Viscosity; amperometric detection; backward facing step flow; turbulence model;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems (NEMS), 2013 8th IEEE International Conference on
Conference_Location
Suzhou
Electronic_ISBN
978-1-4673-6351-8
Type
conf
DOI
10.1109/NEMS.2013.6559797
Filename
6559797
Link To Document