Title :
Fabrication of three-dimensional metallic microcomponents in fused silica by a femtosecond laser & micromoulding (FLM) method
Author :
Keyin Liu ; Yulong Zhao ; Qing Yang ; Feng Chen ; Shengguan He ; Xiaole Fan ; Lei Li ; Chao Shan ; Hao Bian
Author_Institution :
State Key Lab. for Manuf. Syst. Eng., Xi´an Jiaotong Univ., Xian, China
Abstract :
Three-dimensional (3D) metallic microdevices are essential for the micro-electromechanical systems (MEMS) and microfluidic applications. In this paper, a femtosecond laser based micromoulding (FLM) method is employed to fabricate 3D metallic conductive microcomponents in fused silica. 3D microcavities/ microchannels in fused silica, which are served as the molds of metallic microcomponents, are fabricated by taking full advantage of the improved femtosecond laser irradiation followed by chemical etching (FLICE) technology. Solid metallic conductive microcomponents are then achieved in the 3D micromolds by injecting liquid metal with a microfluidic-compatible micromoulding device and solidifying the liquid metal. The FLM technology consists of a facile and maskless fabricating procedure, and enables convenient application of the inherently aligned 3D metallic microcomponents in microfluidic systems.
Keywords :
laser beam etching; microcavities; microfabrication; microfluidics; moulding; silicon compounds; 3D metallic microdevices; 3D microcavities; FLICE technology; FLM method; MEMS; SiO2; femtosecond laser & micromoulding method; femtosecond laser irradiation followed by chemical etching technology; liquid metal solidification; maskless fabrication procedure; microchannels; microelectromechanical systems; microfluidic applications; solid metallic conductive microcomponents; three-dimensional metallic conductive microcomponents fabrication; three-dimensional metallic microdevices; Gallium; Liquids; Microchannel; Microfluidics; Microstructure; Silicon compounds; 3D metallic microstructures; femtosecond laser; liquid metal; micromoulding;
Conference_Titel :
Nano/Micro Engineered and Molecular Systems (NEMS), 2013 8th IEEE International Conference on
Conference_Location :
Suzhou
Electronic_ISBN :
978-1-4673-6351-8
DOI :
10.1109/NEMS.2013.6559820