DocumentCode :
619044
Title :
Thermoelectric Properties Investigation of Single nanowires by utilizing a Thermoelectric Nanowire Characterization Platform
Author :
Zhi Wang ; Ruhhammer, J. ; Adhikari, Sulav ; Rostek, R. ; Moser, David ; Paul, O. ; Kojda, D. ; Mitdank, R. ; Fischer, S.F. ; Toellner, W. ; Nielsch, K. ; Kroener, M. ; Woias, P.
Author_Institution :
Dept. of Microsyst. Eng., Univ. of Freiburg, Freiburg, Germany
fYear :
2013
fDate :
7-10 April 2013
Firstpage :
738
Lastpage :
741
Abstract :
We demonstrate the design and fabrication of a novel micromachined Thermoelectric Nanowire Characterization Platform (TNCP) which is utilized to characterize the thermoelectric properties of various nanowires. Single nanowire is assembled onto the pre-fabricated TNCP by means of dielectrophoresis (DEP) in combination with a water droplet evaporation scheme. After assembly, a reliable ohmic contact is generated between the bismuth telluride (Bi2Te3) nanowire and the underlying electrodes by means of scanning electron microscope (SEM) focused electron beam-induced deposition (EBID). Finally, the electrical conductivity and Seebeck coefficient of Silver (Ag) and Bi2Te3 nanowires are investigated and presented in this paper.
Keywords :
Seebeck effect; bismuth compounds; electrical conductivity; electrochemical electrodes; electrophoresis; micromachining; nanofabrication; nanowires; ohmic contacts; scanning electron microscopy; silver; Ag; Bi2Te3; Bi2Te3 nanowire; EBID; SEM; Seebeck coefficient; dielectrophoresis; electrical conductivity; electrodes; focused electron beam-induced deposition; micromachined thermoelectric nanowire characterization platform; ohmic contact; prefabricated TNCP; scanning electron microscopy; silver nanowires; single nanowires; thermoelectric properties; water droplet evaporation; Electrodes; Fabrication; Heating; Nanowires; Resists; Silicon; Temperature measurement; Ag nanowires; Bi2Te3 nanowires; TNCP; thermoelectric properties;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nano/Micro Engineered and Molecular Systems (NEMS), 2013 8th IEEE International Conference on
Conference_Location :
Suzhou
Electronic_ISBN :
978-1-4673-6351-8
Type :
conf
DOI :
10.1109/NEMS.2013.6559834
Filename :
6559834
Link To Document :
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