Title :
Flexible MEMS inductors based on Parylene-FeNi Compound Substrate for wireless power transmission system
Author :
Yang Zheng ; Xuming Sun ; Zhongliang Li ; Xiuhan Li ; Haixia Zhang
Author_Institution :
Nat. Key Lab. of Sci. & Technol. on Micro/Nano Fabrication, Peking Univ., Beijing, China
Abstract :
In this paper, flexible MEMS inductors based on Parylene-FeNi Compound Substrate (PFCS) were designed, fabricated and analyzed. We choose parylene as substrate to achieve flexibility and good bio-compatibility. Then, a Ni80Fe20 magnetic film was deposited on the parylene film to form a compound substrate. Moreover, a Ni80Fe20 core was also deposited in the center of the spiral inductor to improve its performance. As the radius of magnetic core increased from 800μm to 1200μm, the maximum quality factor and the inductance increased by 288% (from 4.10 to 15.91) and 297% (from 265.94nH to 1.06uH), respectively. If we replaced the magnetic core with magnetic array, the maximum quality factor and the inductance could improve by 111.45% (from 6.29 to 13.30) and 102.78% (from 470.97nH to 955.05nH). Finally, the PFCS inductors were tested in our experimental system.
Keywords :
Q-factor; ferromagnetic materials; flexible electronics; inductive power transmission; inductors; magnetic cores; magnetic thin films; microfabrication; micromechanical devices; nickel compounds; soft magnetic materials; Ni80Fe20; PFCS inductors; ferronickel soft magnetic material; flexible MEMS inductors; magnetic array; magnetic core; magnetic film; parylene film; parylene-ferronickel compound substrate; quality factor; radius 800 mum to 1200 mum; spiral inductor; wireless power transmission system; Coils; Inductance; Inductors; Magnetic cores; Micromechanical devices; Q-factor; Testing; high inductance and quality factor; inductor; magnetic core; parylene substrate;
Conference_Titel :
Nano/Micro Engineered and Molecular Systems (NEMS), 2013 8th IEEE International Conference on
Conference_Location :
Suzhou
Electronic_ISBN :
978-1-4673-6351-8
DOI :
10.1109/NEMS.2013.6559891