Title :
Undercut edges for robust capillary self-alignment in hybrid microassembly
Author :
Liimatainen, Ville ; Sariola, Veikko ; Quan Zhou
Author_Institution :
Dept. of Autom. & Syst. Technol., Aalto Univ., Aalto, Finland
Abstract :
In this paper, we report capillary self-alignment of 200 ×x 200 μm square parts on matching patterns with undercut edges. The undercut edge structure is a purely topographical feature that provides ultimate pinning for liquids of any surface tension without chemical treatment. We show contact angles close to 180° for low surface tension liquids, and capillary self-alignment using thermally curable adhesive. Submicron alignment accuracy after adhesive curing is verified in a scanning electron microscope (SEM).
Keywords :
adhesives; contact angle; curing; microassembling; microfabrication; scanning electron microscopy; surface tension; SEM; contact angles; hybrid microassembly; low-surface tension liquid; matching patterns; robust capillary self-alignment; scanning electron microscope; submicron alignment accuracy; surface tension; thermally-curable adhesive; topographical feature; undercut edge structure; Accuracy; Image edge detection; Liquids; Microscopy; Silicon; Surface tension; Surface treatment; microassembly; microfabrication; self-alignment; surface tension; wetting;
Conference_Titel :
Nano/Micro Engineered and Molecular Systems (NEMS), 2013 8th IEEE International Conference on
Conference_Location :
Suzhou
Electronic_ISBN :
978-1-4673-6351-8
DOI :
10.1109/NEMS.2013.6559911
