Title :
Micromachined inductor integrated with a patterned soft magnetic thin film
Author :
Yu-Che Huang ; Ben-Hwa Jang ; Weileun Fang
Author_Institution :
Dept. of Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Abstract :
This study demonstrates a novel design and fabrication process to realize micromachined inductor integrated with the patterned soft magnetic film. Highly resistive (CoFeB)(SiO2) films as soft magnetic films were patterned and deposited by lift-off process and sputtering technique, respectively. In order to enhance inductor´s inductance and find out the major design parameters, three types of the inductors integrated with the patterned soft magnetic films were designed, fabricated and tested. The spiral type inductor was fabricated by copper electroplating. This novel approach integrates inductors with soft magnetic thin films by evaporating the nitride film as dielectric and protection layer. As a result, the influence of the soft magnetic film contributes 10 % increase in the inductance on “magnetic film aligned” inductor at 2 GHz.
Keywords :
chemical vapour deposition; cobalt compounds; electroplating; inductors; iron compounds; magnetic thin film devices; magnetic thin films; micromachining; silicon compounds; soft magnetic materials; (CoFeB)(SiO2); LPCVD; copper electroplating; dielectric layer; frequency 2 GHz; highly resistive films; inductor inductance enhancement; low-pressure chemical vapor deposition; magnetic film aligned inductor; micromachined inductor design; micromachined inductor fabrication process; nitride film evaporation; patterned soft magnetic thin film; protection layer; spiral type inductor; Dielectrics; Fabrication; Inductance; Inductors; Magnetic films; Spirals; RF; integrated inductor; patterned film;
Conference_Titel :
Nano/Micro Engineered and Molecular Systems (NEMS), 2013 8th IEEE International Conference on
Conference_Location :
Suzhou
Electronic_ISBN :
978-1-4673-6351-8
DOI :
10.1109/NEMS.2013.6559913
