Dual band aperture coupled cylindrical dielectric resonator antenna array

Author

Baba, A.A. ; Zakariya, M.A. ; Baharudin, Z. ; Khir, M. H. Md ; Ali, Shaima Mohammed ; Adz, J.J.

Author_Institution

Electr. & Electron. Eng. Dept., Univ. Teknol. PETRONAS, Tronoh, Malaysia

fYear

2013

fDate

7-9 April 2013

Firstpage

150

Lastpage

155

Abstract

In this paper, the tuning technique of 3-elements cylindrical dielectric resonator antenna (CDRA) array for wireless LAN 802.11 a/b/g standard applications is studied experimentally. The rectangular shaped aperture slots are used to excite the first and last radiating element. The aperture slots etched on the ground plane are excited by using the 50Ω microstrip transmission line. The electromagnetic coupling technique is used to excite the middle radiating element to enhance the antenna bandwidth as well as gain. The effects of changing the dimensions of slot width on the resonance frequency are also analyzed using a CST microwave studio. The simulated and measured results have successfully given the resonance at 2.45 and 5.0 GHz. The 2-D and 3-D radiation patterns of the proposed dual band antenna are addressed in this paper.

Keywords

UHF antennas; antenna radiation patterns; dielectric resonator antennas; microstrip antenna arrays; microwave antenna arrays; microwave antennas; multifrequency antennas; wireless LAN; 2D radiation pattern; 3D radiation pattern; IEEE 802.11 a; IEEE 802.11 b; IEEE 802.11 g; aperture coupled antenna array; aperture slot; cylindrical dielectric antenna array; dual band antenna array; frequency 2.45 GHz; frequency 5 GHz; microstrip transmission line; resonator antenna array; slot width; three element cylindrical dielectric resonator antenna; tuning technique; wireless LAN; Apertures; Arrays; Dielectric resonator antennas; Dielectrics; Microstrip; Microstrip antennas; Resonant frequency; Aperture slots; Cylindrical dielectric resonator antenna (CDRA); Microstrip line;

fLanguage

English

Publisher

ieee

Conference_Titel

Business Engineering and Industrial Applications Colloquium (BEIAC), 2013 IEEE

Conference_Location

Langkawi

Print_ISBN

978-1-4673-5967-2

Type

conf

DOI

10.1109/BEIAC.2013.6560102

Filename

6560102