• DocumentCode
    619217
  • Title

    Effect of various activation methods on the reactivity of ground dune sand as partial cement replacement

  • Author

    Abdullah, Ammar ; Alhozaimy, Abdulrahman

  • Author_Institution
    Fac. of Appl. Sci., Univ. Teknol. Mara (UiTM), Shah Alam, Malaysia
  • fYear
    2013
  • fDate
    7-9 April 2013
  • Firstpage
    290
  • Lastpage
    295
  • Abstract
    Dune sand obtained in the vicinity of Riyadh, Saudi Arabia was investigated to be used as partial cement replacement materials. Physical and chemical properties of dune sand were evaluated. Dune sand is inert and chemically inactive under normal curing condition. In this study, three different methods including chemical, mechanical and thermal activation were employed to enhance the reactivity of dune sand. The final products obtained were further analyzed by X-ray diffraction (XRD), scanning electron microscope (SEM), differential thermal analysis (DTA) and the thermogravimetric analysis (TGA) to investigate the promoting mechanism of the compressive strength. Replacement of cement with 30% dune sand displayed the highest compressive strength and lowest free Ca(OH)2 content when it was subjected to the thermal activation under autoclave curing.
  • Keywords
    X-ray diffraction; cements (building materials); compressive strength; curing; differential thermal analysis; sand; scanning electron microscopy; DTA; Riyadh Saudi Arabia; SEM; TGA; X-ray diffraction; XRD; autoclave curing; chemical activation; compressive strength; differential thermal analysis; ground dune sand reactivity; mechanical activation; partial cement replacement; scanning electron microscope; thermal activation; thermogravimetric analysis; Chemicals; Concrete; Curing; Powders; Scanning electron microscopy; X-ray scattering; DTA; SEM; TGA; XRD; activation; autoclave curing; characterization; dune sand;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Business Engineering and Industrial Applications Colloquium (BEIAC), 2013 IEEE
  • Conference_Location
    Langkawi
  • Print_ISBN
    978-1-4673-5967-2
  • Type

    conf

  • DOI
    10.1109/BEIAC.2013.6560134
  • Filename
    6560134