DocumentCode :
619231
Title :
Development of room temperature vapor sensor system based on tungsten organometallic-PANi thin film
Author :
Zaine, I.S. ; Zabidi, Z.M. ; Alias, A.N. ; Jumali, M.H.
Author_Institution :
Dept. of Appl. Sci., Univ. Teknol. MARA, Permatang Pauh, Malaysia
fYear :
2013
fDate :
7-9 April 2013
Firstpage :
359
Lastpage :
363
Abstract :
The aim of this research is to develop vapor sensor system which works at room temperature. The development of system was used to test vapor sensing properties of tungsten organometallic-PANi thin film towards isopropanol and ethanol vapors. Tungsten organometallic solution was prepared by sol gel method. Commercial PANi powder were directly added into tungsten organometallic solution to form composite solution. Five layers of the solution were deposited onto SiO2 coated silicon substrate using spin coating technique for fabrications of vapor sensing device. The vapor sensing test revealed that the composite film was responsive towards isopropanol and ethanol vapors with sensitivity of 5.58% and 4.76% each. The reversibility of sensor towards isopropanol vapor is 1.37 and towards ethanol vapor is 1.16. Meanwhile the response time for the sensor towards isopropanol vapor is 81 s and towards ethanol vapor is 108 s. The recovery time towards both vapors are same i.e. 189 s.
Keywords :
conducting polymers; filled polymers; gas sensors; organometallic compounds; powders; sol-gel processing; spin coating; temperature sensors; thin film sensors; tungsten compounds; SiO2-Si; W; composite film; deposition; ethanol vapor; isopropanol vapor; sensor reversibility; sol-gel method; spin coating teehnique; temperature 293 K to 298 K; time 108 s; time 189 s; time 81 s; tungsten organometallic-PANi thin film; vapor sensor system; Educational institutions; Electron tubes; Fabrication; Heating; Oxidation; Polymers; Steel; polyaniline; room temperature; thin film; tungsten organometallic; vapor sensor;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Business Engineering and Industrial Applications Colloquium (BEIAC), 2013 IEEE
Conference_Location :
Langkawi
Print_ISBN :
978-1-4673-5967-2
Type :
conf
DOI :
10.1109/BEIAC.2013.6560148
Filename :
6560148
Link To Document :
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