DocumentCode
619231
Title
Development of room temperature vapor sensor system based on tungsten organometallic-PANi thin film
Author
Zaine, I.S. ; Zabidi, Z.M. ; Alias, A.N. ; Jumali, M.H.
Author_Institution
Dept. of Appl. Sci., Univ. Teknol. MARA, Permatang Pauh, Malaysia
fYear
2013
fDate
7-9 April 2013
Firstpage
359
Lastpage
363
Abstract
The aim of this research is to develop vapor sensor system which works at room temperature. The development of system was used to test vapor sensing properties of tungsten organometallic-PANi thin film towards isopropanol and ethanol vapors. Tungsten organometallic solution was prepared by sol gel method. Commercial PANi powder were directly added into tungsten organometallic solution to form composite solution. Five layers of the solution were deposited onto SiO2 coated silicon substrate using spin coating technique for fabrications of vapor sensing device. The vapor sensing test revealed that the composite film was responsive towards isopropanol and ethanol vapors with sensitivity of 5.58% and 4.76% each. The reversibility of sensor towards isopropanol vapor is 1.37 and towards ethanol vapor is 1.16. Meanwhile the response time for the sensor towards isopropanol vapor is 81 s and towards ethanol vapor is 108 s. The recovery time towards both vapors are same i.e. 189 s.
Keywords
conducting polymers; filled polymers; gas sensors; organometallic compounds; powders; sol-gel processing; spin coating; temperature sensors; thin film sensors; tungsten compounds; SiO2-Si; W; composite film; deposition; ethanol vapor; isopropanol vapor; sensor reversibility; sol-gel method; spin coating teehnique; temperature 293 K to 298 K; time 108 s; time 189 s; time 81 s; tungsten organometallic-PANi thin film; vapor sensor system; Educational institutions; Electron tubes; Fabrication; Heating; Oxidation; Polymers; Steel; polyaniline; room temperature; thin film; tungsten organometallic; vapor sensor;
fLanguage
English
Publisher
ieee
Conference_Titel
Business Engineering and Industrial Applications Colloquium (BEIAC), 2013 IEEE
Conference_Location
Langkawi
Print_ISBN
978-1-4673-5967-2
Type
conf
DOI
10.1109/BEIAC.2013.6560148
Filename
6560148
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