DocumentCode
619346
Title
Extraction of essential oil from biologically inoculated agarwood
Author
Fadzil, Abdul Hakim Muhammad ; Hamid, Ku Halim Ku ; Rodhi, Miradatul Najwa Muhd ; Mohd Kamaruddin, Laila
Author_Institution
Fac. of Chem. Eng., Univ. Teknol. MARA, Shah Alam, Malaysia
fYear
2013
fDate
7-9 April 2013
Firstpage
889
Lastpage
892
Abstract
Agarwood becomes one of the valuable forest products compared to others due to its quality which makes the wood is in high demand. High yield of agarwood is used as a medicinal product and this has been recorded in the Sahih Muslim, which dates back to approximately the eighth century, and in the Ayurvedic medicinal text known as Susruta Samhita. Agarwood oil and its incense are used for their fragrant properties. Therefore, it is commonly used as perfumes and has been recorded in the Old Testament. Biologically inoculated agarwood is new to research due to the development of bio based inoculants. Chemical based extracted oil and hydrosol claims resulting low quality of resin formation, thus produce low quality of essential oil. Replacement for bio resin formation will ensure the safety of end product used for medicine, perfumery and food industry. Agarwood´s essential oil production has been lacking in terms of maintaining the high grading and the yield due to the loss of major volatile component that effect the aroma.
Keywords
essential oils; resins; wood products; agarwood oil; aroma; bio based inoculant; bio resin formation replacement; biologically inoculated agarwood; chemical based extracted oil; end product safety; essential oil extraction; essential oil production; food industry; forest product; fragrant property; hydrosol; medicinal product; medicine industry; perfumery industry; Chemical compounds; Chemicals; Compounds; Hydrocarbons; Oils; Vegetation; Aquilaria malacccencis; agarwood; essential oil; gas chromatography-mass spectrometry;
fLanguage
English
Publisher
ieee
Conference_Titel
Business Engineering and Industrial Applications Colloquium (BEIAC), 2013 IEEE
Conference_Location
Langkawi
Print_ISBN
978-1-4673-5967-2
Type
conf
DOI
10.1109/BEIAC.2013.6560264
Filename
6560264
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