• DocumentCode
    61979
  • Title

    Detection of Micro-Arc Discharge Using ESC Wafer Stage With Built-In AE Sensor

  • Author

    Kasashima, Y. ; Tabaru, Tatsuo ; Kobayashi, Yoshiyuki ; Yasaka, Mitsuo ; Yamaguchi, Satarou ; Akiyama, Masanori ; Uesugi, F.

  • Author_Institution
    Meas. Solution Res. Center, Nat. Inst. of Adv. Ind. Sci. & Technol., Saga, Japan
  • Volume
    26
  • Issue
    3
  • fYear
    2013
  • fDate
    Aug. 2013
  • Firstpage
    350
  • Lastpage
    354
  • Abstract
    An electrostatic chuck (ESC) wafer stage with a built-in acoustic emission (AE) sensor is developed to detect micro-arc discharge occurring around a wafer. The built-in AE sensor detects acoustic waves caused by anomalous discharge with high sensitivity. The results demonstrate the effectiveness of this novel ESC wafer stage for detecting micro-arc discharge occurring around a wafer and will contribute greatly to improving the production yield of semiconductor manufacturing.
  • Keywords
    acoustic transducers; acoustic waves; arcs (electric); integrated circuit yield; acoustic waves; anomalous discharge; built-in acoustic emission sensor; electrostatic chuck wafer stage; micro-arc discharge detection; production yield; semiconductor manufacturing; Acoustic emission sensor; Micro-arc discharge; electrostatic chuck; plasma etching;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/TSM.2013.2263295
  • Filename
    6516517