• DocumentCode
    620683
  • Title

    Temperature compensated AlN/SiO2 structures for Lamb wave resonators

  • Author

    Naumenko, N.

  • fYear
    2012
  • fDate
    7-10 Oct. 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Characteristics of lower symmetric and antisymmetric modes s0 and a0 (velocities, electromechanical coupling coefficients, TCF) were numerically investigated in Lamb wave resonators using AlN and AlN/SiO2 membranes. Two configurations of AlN/SiO2 structure were compared, with SiO2 film located either at the bottom or on top of AlN. All characteristics were calculated as functions of SiO2 film thickness with normalized AlN thickness varying between 0.1λ and 0.5λ. The influence of uniform Al electrode at the bottom of AlN on the Lamb wave characteristics has been studied. For symmetric mode s0 it was found that SiO2 film thickness, which is required for zero TCF, decreases from 60% to 25% of AlN thickness when the latter grows from 0.1λ to 0.5λ. The electromechanical coupling of s0 mode in the temperature compensated structure depends on the presence of metal film at the bottom of AlN and drops with poor conductivity of this film. The behavior of the reflection coefficient per period of the grating reveals the crucial difference between the analyzed configurations.
  • Keywords
    acoustic resonators; aluminium compounds; compensation; membranes; metallic thin films; piezoelectric semiconductors; semiconductor thin films; silicon compounds; AlN-SiO2; Lamb wave resonators; antisymmetric modes; electromechanical coupling coefficients; lamb wave resonators; metal film; reflection coefficient; temperature compensated structure; Couplings; Dispersion; Electrodes; Films; Gratings; III-V semiconductor materials; Reflection coefficient;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2012 IEEE International
  • Conference_Location
    Dresden
  • ISSN
    1948-5719
  • Print_ISBN
    978-1-4673-4561-3
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2012.0198
  • Filename
    6561932