DocumentCode :
620780
Title :
cMUT probe cooling design by thermal network
Author :
Kyungil Cho ; Baehyung Kim ; Youngil Kim ; Seunghun Lee ; Jongkeun Song
Author_Institution :
Samsung Adv. Inst. of Technol., Samsung Electron. Co., Yongin, South Korea
fYear :
2012
fDate :
7-10 Oct. 2012
Firstpage :
631
Lastpage :
634
Abstract :
A cooling system for the cMUT (Capacitance Micro machined Ultrasonic Transducer) probe is designed in efficient way and realized. First, cMUT specific thermal spreader is optimally designed to transport the heat load from the heat source to the heat pipe. Small fins with micro fans for the heat sinks are thermally linked with the heat pipe. Experiments are performed to evaluate the thermal resistances of the each component. Finally, the desired thermal resistance of the heat sink is estimated by using the thermal network analysis, which is realized with the air fans and the fins.
Keywords :
capacitive sensors; cooling; fans; microsensors; thermal management (packaging); thermal resistance measurement; ultrasonic transducers; cMUT probe cooling design; capacitance micromachined ultrasonic transducer probe; cooling system; fins; heat load; heat pipe; heat source; microfans; thermal network analysis; thermal resistance evaluation; thermal spreader; Heat sinks; Heating; Probe Cooling; ThermalNetwork; Ultrasound; cMUT;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium (IUS), 2012 IEEE International
Conference_Location :
Dresden
ISSN :
1948-5719
Print_ISBN :
978-1-4673-4561-3
Type :
conf
DOI :
10.1109/ULTSYM.2012.0157
Filename :
6562127
Link To Document :
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