Title :
SAW waveguiding in high aspect ratio transducers
Author :
Socie, Ludovic ; Benchabane, Sarah ; Robert, L. ; Laude, V.
Author_Institution :
ENSMM, Univ. de Franche-Comte, Besancon, France
Abstract :
Efficient acoustic waveguides with a confinement in 3-dimensional space were obtained using high aspect ratio interdigital transducers (HAR IDTs). Energy trapping at the substrate surface is ensured by mass loading effect, while lateral confinement is preserved while reducing the acoustic aperture of the HAR IDTs down to one acoustic wavelength. A detailed analysis of such HAR IDTs fabricated on X-cut lithium niobate, with Y-propagating waves is presented. Reflection scattering parameter measurements were performed and are here reported. They show the existence of several modes with a resonance frequency much lower than the one expected for a Rayleigh wave. The wave velocity is indeed reduced from 3639 m/s down to 781 m/s. Using heterodyne laser scanning interferometry, measurements of out-of-plane displacement induced by the generated surface waves were performed. The measurement results show that the elastic energy is strongly localized within the acoustic aperture of the transducer.
Keywords :
Rayleigh waves; acoustic resonance; acoustic wave interferometry; displacement measurement; heterodyne detection; interdigital transducers; measurement by laser beam; surface acoustic wave transducers; ultrasonic measurement; ultrasonic reflection; ultrasonic scattering; 3D space; HAR; IDT; Rayleigh wave; SAW transducer; SAW waveguide; acoustic aperture; acoustic wavelength; elastic energy; energy trapping; heterodyne laser scanning interferometry; high aspect ratio; interdigital transducer; mass loading effect; out of plane displacement measurement; reflection scattering parameter measurement; resonance frequency; substrate surface; Acoustic measurements; Apertures; Electrodes; Optical surface waves; Substrates; Surface acoustic waves; high aspect ratio; interdigital transducer; surface acoustic wave;
Conference_Titel :
Ultrasonics Symposium (IUS), 2012 IEEE International
Conference_Location :
Dresden
Print_ISBN :
978-1-4673-4561-3
DOI :
10.1109/ULTSYM.2012.0450