Transmitter PIC for THz applications based on generic integration technology

Author

Soares, Francisco M. ; Kreissl, Jochen ; Theurer, M. ; Bitincka, E. ; Goebel, T. ; Moehrle, Martin ; Grote, N.

Author_Institution

Photonics Components Dept., Fraunhofer Inst. for Telecommun., Berlin, Germany

fYear

2013

fDate

19-23 May 2013

Firstpage

1

Lastpage

2

Abstract

A generic InP based monolithic photonic integration platform is introduced that is capable of simultaneously incorporating transmitter, receiver and passive-optical functionalities. On this basis, an integrated transmitter component for THz applications has been implemented.

Keywords

III-V semiconductors; indium compounds; integrated optics; microwave photonics; optical receivers; optical transmitters; THz applications; generic integration technology; integrated transmitter component; monolithic photonic integration platform; passive-optical functionalities; receiver; transmitter; transmitter PIC; Integrated optics; Measurement by laser beam; Optical device fabrication; Optical transmitters; Optical waveguides; Photonics; Waveguide lasers; THz transmitter; building blocks; butt-joint technology; component; generic PIC technology; integrated DFB laser;

fLanguage

English

Publisher

ieee

Conference_Titel

Indium Phosphide and Related Materials (IPRM), 2013 International Conference on

Conference_Location

Kobe

ISSN

1092-8669

Print_ISBN

978-1-4673-6130-9

Electronic_ISBN

1092-8669

Type

conf

DOI

10.1109/ICIPRM.2013.6562628

Filename

6562628