• DocumentCode
    621075
  • Title

    35 nm mHEMT Technology for THz and ultra low noise applications

  • Author

    Leuther, A. ; Tessmann, A. ; Dammann, Michael ; Massler, Hermann ; Schlechtweg, Michael ; Ambacher, Oliver

  • Author_Institution
    Fraunhofer Inst. for Appl. Solid State Phys. (IAF), Freiburg, Germany
  • fYear
    2013
  • fDate
    19-23 May 2013
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    In this paper we present a very compact 0.28 × 0.55 mm2 six-stage terahertz monolithic integrated circuit (TMIC) using 35 nm gate length metamorphic high electron mobility transistors (mHEMTs). A linear gain of 20.3 dB at 610 GHz and more than 18 dB over the bandwidth from 557 to 616 GHz was achieved for a drain voltage Vd of only 0.6 V. The noise performance of the 35 nm mHEMT was investigated on the basis of a packaged H-band amplifier which achieved a small-signal gain of more than 20 dB between 220 and 300 GHz. The averaged measured noise figure was 6.1 dB which is to our knowledge the lowest published value of any MMIC technology in this frequency range. To determine the transistor reliability accelerated lifetime tests in air were done. Based on a 20 % gm_max degradation failure criterion a median time to failure of 1.8 × 105 h at a channel temperature of 75°C and VDS = 0.8 V was extrapolated
  • Keywords
    MMIC; high electron mobility transistors; integrated circuit noise; MMIC technology; bandwidth 557 GHz to 616 GHz; degradation failure criterion; drain voltage; frequency 610 GHz; frequency range; gain 20.3 dB; mHEMT technology; metamorphic high electron mobility transistor; noise figure; noise figure 6.1 dB; packaged H-band amplifier; size 35 nm; small signal gain; temperature 75 C; terahertz monolithic integrated circuit; transistor reliability; ultra low noise application; voltage 0.6 V; voltage 0.8 V; Frequency measurement; Gain; Logic gates; MMICs; Noise figure; mHEMTs;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Indium Phosphide and Related Materials (IPRM), 2013 International Conference on
  • Conference_Location
    Kobe
  • ISSN
    1092-8669
  • Print_ISBN
    978-1-4673-6130-9
  • Electronic_ISBN
    1092-8669
  • Type

    conf

  • DOI
    10.1109/ICIPRM.2013.6562647
  • Filename
    6562647