DocumentCode :
624334
Title :
Design space exploration for reliable mm-wave wireless NoC architectures
Author :
Wettin, Paul ; Pande, Partha Pratim ; Deukhyoun Heo ; Belzer, Benjamin ; Deb, Sujay ; Ganguly, Anshuman
Author_Institution :
Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
fYear :
2013
fDate :
5-7 June 2013
Firstpage :
79
Lastpage :
82
Abstract :
The Network-on-Chip (NoC) paradigm is used as a scalable interconnection infrastructure for multi-core chips. To enhance the performance of conventional interconnect-based multi-core chips, on-chip wireless interconnect has emerged as a radically different technology. However, this emerging interconnect paradigm imposes significant challenges pertaining to reliable integration and design. In this paper, we focus on two types of mm-wave wireless NoC architectures. One is a hierarchical architecture with long-range wireless shortcuts and the other is a power-law connectivity based small-world network without any hierarchy. We demonstrate that though the hierarchical architecture offers more bandwidth with lower energy dissipation than the small-world-based counterpart, it has significantly more area overhead. Also, the power-law connectivity based small-world wireless NoC is more robust in presence of wireless link failures.
Keywords :
computer architecture; multiprocessing systems; network-on-chip; Network-on-Chip; NoC paradigm; design space exploration; interconnect based multicore chips; lower energy dissipation; onchip wireless interconnection; power law connectivity; reliable mm-wave wireless NoC architectures; scalable interconnection infrastructure; wireless link failures; Bandwidth; Computer architecture; Ports (Computers); Routing; Switches; System-on-chip; Wireless communication; NoC; mm-wave; small world; wireless;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Application-Specific Systems, Architectures and Processors (ASAP), 2013 IEEE 24th International Conference on
Conference_Location :
Washington, DC
ISSN :
2160-0511
Print_ISBN :
978-1-4799-0494-5
Type :
conf
DOI :
10.1109/ASAP.2013.6567554
Filename :
6567554
Link To Document :
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