• DocumentCode
    624334
  • Title

    Design space exploration for reliable mm-wave wireless NoC architectures

  • Author

    Wettin, Paul ; Pande, Partha Pratim ; Deukhyoun Heo ; Belzer, Benjamin ; Deb, Sujay ; Ganguly, Anshuman

  • Author_Institution
    Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
  • fYear
    2013
  • fDate
    5-7 June 2013
  • Firstpage
    79
  • Lastpage
    82
  • Abstract
    The Network-on-Chip (NoC) paradigm is used as a scalable interconnection infrastructure for multi-core chips. To enhance the performance of conventional interconnect-based multi-core chips, on-chip wireless interconnect has emerged as a radically different technology. However, this emerging interconnect paradigm imposes significant challenges pertaining to reliable integration and design. In this paper, we focus on two types of mm-wave wireless NoC architectures. One is a hierarchical architecture with long-range wireless shortcuts and the other is a power-law connectivity based small-world network without any hierarchy. We demonstrate that though the hierarchical architecture offers more bandwidth with lower energy dissipation than the small-world-based counterpart, it has significantly more area overhead. Also, the power-law connectivity based small-world wireless NoC is more robust in presence of wireless link failures.
  • Keywords
    computer architecture; multiprocessing systems; network-on-chip; Network-on-Chip; NoC paradigm; design space exploration; interconnect based multicore chips; lower energy dissipation; onchip wireless interconnection; power law connectivity; reliable mm-wave wireless NoC architectures; scalable interconnection infrastructure; wireless link failures; Bandwidth; Computer architecture; Ports (Computers); Routing; Switches; System-on-chip; Wireless communication; NoC; mm-wave; small world; wireless;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Application-Specific Systems, Architectures and Processors (ASAP), 2013 IEEE 24th International Conference on
  • Conference_Location
    Washington, DC
  • ISSN
    2160-0511
  • Print_ISBN
    978-1-4799-0494-5
  • Type

    conf

  • DOI
    10.1109/ASAP.2013.6567554
  • Filename
    6567554