• DocumentCode
    624371
  • Title

    Incorporating temperature-leakage interdependency into dynamic voltage scaling for real-time systems

  • Author

    Junjun Gu ; Gang Qu

  • Author_Institution
    Altera Corp., San Jose, CA, USA
  • fYear
    2013
  • fDate
    5-7 June 2013
  • Firstpage
    289
  • Lastpage
    296
  • Abstract
    Energy efficiency is critical for many application specific real-time systems. Dynamic voltage scaling (DVS) is one of the most effective and well-studied techniques. In this paper, we study the interdependency of temperature and leakage and how it influences DVS. We derive an analytic temperature-leakage model, which has an average error of 0.5°K from the accurate numerical result. This temperature-leakage model enables us to perform temperature aware DVS for total energy minimization without using on-chip temperature sensors. We find that the most energy efficient way to complete a single task is, unlike the existing approaches that use high voltage to save leakage, to scale voltage down to the lowest level without missing the task´s deadline. Based on this new finding, we propose an online DVS algorithm to schedule multiple tasks on real-time system. Simulation results show that our algorithm can achieve total energy saving over a state-of-the-art leakage aware DVS approach by as high as 14% and more than 9% on average.
  • Keywords
    energy conservation; power aware computing; real-time systems; scheduling; analytic temperature-leakage model; dynamic voltage scaling; energy efficiency; energy minimization; energy saving; leakage aware DVS approach; multiple task scheduling; online DVS algorithm; real-time systems; temperature aware DVS; temperature-leakage interdependency; Equations; Mathematical model; Minimization; Real-time systems; Temperature sensors; Voltage control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Application-Specific Systems, Architectures and Processors (ASAP), 2013 IEEE 24th International Conference on
  • Conference_Location
    Washington, DC
  • ISSN
    2160-0511
  • Print_ISBN
    978-1-4799-0494-5
  • Type

    conf

  • DOI
    10.1109/ASAP.2013.6567592
  • Filename
    6567592