Hybrid 3D pre-bonding test framework design

Author

Chandran, Unni ; Dan Zhao ; Jayabharathi, Rathish

Author_Institution

Center for Adv. Comput. Studies, Univ. of Louisiana at Lafayette, Lafayette, IN, USA

fYear

2013

fDate

27-30 May 2013

Firstpage

1

Lastpage

1

Abstract

We have proposed in this paper a hybrid wireless test framework for pre-bond testing of 3D-SICs. This framework exploits high data rate & low noise near field inductive coupling mechanism for test data transfer. Test stimuli for IP cores and test control for TSV BIST are wirelessly transmitted through the probe card. Test responses from IP cores and TSV BIST are relayed back to the probe card by WiPads. A scheduling heuristic was further proposed for parallel testing of TSVs and IP cores, achieving reasonably close testing times to LB.

Keywords

built-in self test; inductive power transmission; integrated circuit bonding; integrated circuit testing; logic circuits; microprocessor chips; three-dimensional integrated circuits; IP cores; TSV BIST test control; WiPads; high-data rate-low-noise near-field inductive coupling mechanism; hybrid 3D pre-bonding test framework design; hybrid wireless test framework; parallel testing; probe card; scheduling heuristic; test data transfer; test response; Bandwidth; Built-in self-test; IP networks; Probes; System-on-chip; Wireless communication;

fLanguage

English

Publisher

ieee

Conference_Titel

Test Symposium (ETS), 2013 18th IEEE European

Conference_Location

Avignon

Print_ISBN

978-1-4673-6376-1

Type

conf

DOI

10.1109/ETS.2013.6569388

Filename

6569388