• DocumentCode
    625445
  • Title

    Large-scale power-combining and linearization in watt-class mmWave CMOS power amplifiers

  • Author

    Bhat, Ritesh ; Chakrabarti, Anandaroop ; Krishnaswamy, Harish

  • Author_Institution
    Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
  • fYear
    2013
  • fDate
    2-4 June 2013
  • Firstpage
    283
  • Lastpage
    286
  • Abstract
    Switching-class PAs employing device-stacking have been recently explored to meet the challenge of efficient power amplification at mmWave frequencies at moderate power levels of around 20dBm. In this paper, we propose the use of a single-step, large-scale (8-way), 75%-efficient lumped quarterwave power combiner that is co-designed with stacked Class-Elike PA unit cells to enable a Q-band 45nm SOI CMOS PA with a peak Psat of 27.2dBm (>0.5W), peak PAE of 10.7% and 1dB flatness in Psat over nearly the entire Q-band (3346GHz). This measured output power level is approximately 5 × higher than prior reported mmWave silicon PAs. In order to support complex modulations with high average-efficiency, we also propose a novel linearizing architecture that combines largescale power combining, supply-switching for efficiency under backoff and dynamic load modulation for linearization. A second fully-integrated 42.5GHz 45nm SOI CMOS PA is implemented based on this architecture and achieves 60% of the peak efficiency at 6dB back-off.
  • Keywords
    linearisation techniques; millimetre wave power amplifiers; power combiners; SOI CMOS PA; Watt class mmWave CMOS power amplifiers; complex modulation; dynamic load modulation; frequency 33 GHz to 46 GHz; linearization; linearizing architecture; lumped quarterwave power combiner; mmWave frequency; mmWave silicon PA; power amplification; power combining; size 45 nm; supply switching; switching class PA; Arrays; CMOS integrated circuits; CMOS technology; Digital control; Modulation; Power generation; Switches;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Radio Frequency Integrated Circuits Symposium (RFIC), 2013 IEEE
  • Conference_Location
    Seattle, WA
  • ISSN
    1529-2517
  • Print_ISBN
    978-1-4673-6059-3
  • Type

    conf

  • DOI
    10.1109/RFIC.2013.6569583
  • Filename
    6569583