DocumentCode
62578
Title
Theoretical Model of Plasma Metallization of Ceramic Heat Sinks
Author
Vysikaylo, Philipp I. ; Mitin, Valeriy S. ; Mitin, Aleksey V. ; Krasnobaev, Nikolay N. ; Belyaev, Victor V.
Author_Institution
Plasma Chem. Lab., Moscow Radiotechnical Inst., Moscow, Russia
Volume
43
Issue
3
fYear
2015
fDate
Mar-15
Firstpage
892
Lastpage
895
Abstract
This paper reports a theoretical study of the mechanism of adhesion of a plasma metal coating to a ceramic substrate by an example of beryllium oxide. The adhesion mechanism is based on an increase in the concentration of structural defects (vacancies) and electron exchange interaction of a metal-beryllium oxide pair during the plasma thermal activation of the process. The proposed analysis of the substrate boundary conditions on an example of titanium atoms and beryllium oxide justifies the optimal regime of the coating deposition in plasma (heating temperature, deposition time, and activation energy) with the maximum adhesion of the plasma metal coating. It is in good agreement with the experimental studies. According to the analytical calculations, the substrate temperature for an ideal surface as well as the maximum adhesion of the plasma metal coating is 1230 K in the case of beryllium oxide, whereas the experimental temperature is about 1380 K.
Keywords
adhesion; beryllium compounds; ceramics; exchange interactions (electron); heat sinks; metallic thin films; plasma deposited coatings; plasma deposition; vacancies (crystal); BeO; activation energy; analytical calculations; ceramic heat sinks; ceramic substrate; deposition time; electron exchange interaction; heating temperature; maximum adhesion; metal-beryllium oxide pair; optimal coating deposition regime; plasma metal coating; plasma metallization model; plasma thermal activation; structural defect concentration; substrate boundary condition analysis; substrate temperature; temperature 1230 K; vacancies; Adhesives; Ceramics; Coatings; Metals; Plasmas; Substrates; Surface treatment; High-power microwave devices; mechanism and kinetics of adhesion formation; plasma chemical reaction; plasma metal coating; power layer; vacancy diffusion; vacancy diffusion.;
fLanguage
English
Journal_Title
Plasma Science, IEEE Transactions on
Publisher
ieee
ISSN
0093-3813
Type
jour
DOI
10.1109/TPS.2015.2395871
Filename
7039247
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