DocumentCode :
626446
Title :
Quality perception in 3D interactive environments
Author :
Ciancio, Alexandre ; de Oliveira, Jose F. L. ; Ribeiro, Felipe M. Lopes ; da Silva, E.A.B. ; Said, Amir
Author_Institution :
PEE/COPPE & DEL/Poli, Univ. Fed. do Rio de Janeiro, Rio de Janeiro, Brazil
fYear :
2013
fDate :
19-23 May 2013
Firstpage :
9
Lastpage :
12
Abstract :
In this paper we investigate how configuration and visualization parameters influence the quality of experience in a 3D interactive environment, more specifically in a motion parallax setup. In order to do so, we designed a dedicated testing room and conducted subjective experiments with a team of evaluators. The tests considered parameters such as different disparities, amount of parallax, monitor sizes and visualization angles. Factors such as visual comfort, sense of immersion and the 3D experience as a whole have been assessed. The users were also asked to execute a task in the 3D motion parallax environment assessing the difficulty to complete the task for different parameter configurations. Obtained results suggest that user experience in an immersive environment is not as critically influenced by configuration parameters such as disparity and amount of parallax as initially thought. They also indicate that a better understanding of how this experience is influenced still requires the design and conduction of more comprehensive testing procedures.
Keywords :
computer vision; quality of experience; stereo image processing; video signal processing; 3D experience; 3D immersive environment; 3D interactive environments; 3D motion parallax environment; QoE; comprehensive testing procedures; dedicated testing room; general purpose stereoscopic monitors; motion parallax setup; quality of experience; quality perception; synthetic videos; visual comfort; visualization angles; visualization parameters; Games; Monitoring; Software; Solid modeling; Testing; Tracking; Visualization;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems (ISCAS), 2013 IEEE International Symposium on
Conference_Location :
Beijing
ISSN :
0271-4302
Print_ISBN :
978-1-4673-5760-9
Type :
conf
DOI :
10.1109/ISCAS.2013.6571769
Filename :
6571769
Link To Document :
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